陶瓷pcb
陶瓷pcb
| Ceramic PCB Process capability | ||
| No. | Item | Capability |
| 1 | Material | Al2O3 、 AIN 、Si3A4 |
| 2 | Thermal conductivity | Al2O3： 22.3-29.5w/m.K、 AIN :170w/m.K 、 Si3A4 :85w/m.K |
| 3 | Dielectric constant (1MHz) | Al2O3： 9.5/9.8、 AIN :9 、 Si3A4 :7.8 |
| 4 | Material thickness | 0.2/0.25/0.3/0.38/0.5/0.635 /0.8/1.0/1.2/1.5 (mm) |
| 4 | Material specification | 50.5*50.5/80*50.5/120*120* /127*127/132*142/140*190 (mm) |
| 5 | The Number of layers | 1layer or 2 layers |
| 6 | Min hole diameter | 0.08mm |
| 7 | Hole location accuracy | 0.025mm |
| 8 | Min pattern width/spacing | 0.075mm/0.04mm |
| 9 | Finished copper thickness | 0.5oz/1oz/2oz/4oz/8oz/12oz |
| 10 | Filling hole aspect ratio | 9:1 |
| 11 | Metal surround dam | 50-1000 um |
| 12 | Surface treatment: ENIG | Au：0.025-0.1um Ni：3-7um |
| 13 | Surface treatment: Immersion silver | silver: 0.2-0.5um |
| 14 | Surface treatment: Immersion tin | tin: 0.2-1um |
| 15 | Surface treatment: OSP | 2-5u" |
| 16 | Surface treatment: Immersion NiPdAu | Au:0.025-1um Pd:0.025-0.075um Ni:3-7um |
| 17 | Laser outline tolerance | ±0.10mm (special) ±0.05mm |