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刚性弹性pcb

Rigid-Flex PCB Process capability
No. Item Capability
1 FPC Main material Brand:taiflex、graceth、SY
2 PCB Material Brand:SY、ITEQ、KB、NP
3 Texture PI、 PET
4 Cover Film Brand:taiflex、graceth、SY
5 Max Layers 16layers(sample)、12layers(manufacture)
6 Finish Board thickness  0.25-6.0 mm
7 Min Pattern Width / Spacing 0.05mm/0.05mm
8 Max finished product size 230*450mm
9 Finished Board thickness tolerance ±0.05mm
10 PP Thickness 12.5um 、 25um 、 50um
11 Copper thickness 12um 、 18um 、 36um 、 70um
12 Stiffener materail FR4/PI/PET/SUS/PSA
13 Surface treatment ENIG、Immersion tin、OSP、immersion silver、plating gold
14 Min hole size Mechanical Hole :0.15mm 、Laser Hole0.1mm
15 Hole tolerance NPTH:±0.05mm 、PTH:±0.075mm
16 Cover film color Yellow 、 Black、White、Transparent
17 PI thickness 0.5mil、0.7mil、0.8mil、1mil、2mil
18 Max number of layers of FPC 8 layers
19 Min finished size 5mm*8mm
20 Min pad inner layer(5mil)、outer layer(4mil)
21 Stiffener min size 4mm×5mm
23 Stifferner alignment accuracy ±0.075mm
24 Cover minimum openning size 0.6×0.6mm(steeling tooling)、0.5×0.5mm(Precision tooling)
25 Minimum openning spacing for covering film 0.5mm(Precision tooling)、0.2mm(Laser Routing)、 0.15mm(Normal drilling)
26 Coating film overflow amount(unilateral) Normal0.08-0.12mm 、 Limitation0.03mm
27 Min diameter of gold finger semicircle hole 0.25mm,Normal value0.3mm
28 Rigid-Flex PCB:Peel-off strength 1.4N
29 Rigid-Flex PCB:Planeness Less than 15um before baking; less than 30um after baking
30 Rigid-Flex PCB:thermal shock 288℃(3 times within 10 seconds)
31 Rigid-Flex PCB:W/B gold wire pull > 6g
32 Rigid-Flex PCB:Min board thickness FPCB:0.1mm、4Layers:0.3mm 、6Layers:0.5mm、8Layers:0.6mm、10Layers:0.8mm