刚性弹性pcb
| Rigid-Flex PCB Process capability | ||
| No. | Item | Capability |
| 1 | FPC Main material | Brand:taiflex、graceth、SY |
| 2 | PCB Material | Brand:SY、ITEQ、KB、NP |
| 3 | Texture | PI、 PET |
| 4 | Cover Film | Brand:taiflex、graceth、SY |
| 5 | Max Layers | 16layers(sample)、12layers(manufacture) |
| 6 | Finish Board thickness | 0.25-6.0 mm |
| 7 | Min Pattern Width / Spacing | 0.05mm/0.05mm |
| 8 | Max finished product size | 230*450mm |
| 9 | Finished Board thickness tolerance | ±0.05mm |
| 10 | PP Thickness | 12.5um 、 25um 、 50um |
| 11 | Copper thickness | 12um 、 18um 、 36um 、 70um |
| 12 | Stiffener materail | FR4/PI/PET/SUS/PSA |
| 13 | Surface treatment | ENIG、Immersion tin、OSP、immersion silver、plating gold |
| 14 | Min hole size | Mechanical Hole :0.15mm 、Laser Hole0.1mm |
| 15 | Hole tolerance | NPTH:±0.05mm 、PTH:±0.075mm |
| 16 | Cover film color | Yellow 、 Black、White、Transparent |
| 17 | PI thickness | 0.5mil、0.7mil、0.8mil、1mil、2mil |
| 18 | Max number of layers of FPC | 8 layers |
| 19 | Min finished size | 5mm*8mm |
| 20 | Min pad | inner layer(5mil)、outer layer(4mil) |
| 21 | Stiffener min size | 4mm×5mm |
| 23 | Stifferner alignment accuracy | ±0.075mm |
| 24 | Cover minimum openning size | 0.6×0.6mm(steeling tooling)、0.5×0.5mm(Precision tooling) |
| 25 | Minimum openning spacing for covering film | 0.5mm(Precision tooling)、0.2mm(Laser Routing)、 0.15mm(Normal drilling) |
| 26 | Coating film overflow amount(unilateral) | Normal0.08-0.12mm 、 Limitation0.03mm |
| 27 | Min diameter of gold finger semicircle hole | 0.25mm,Normal value0.3mm |
| 28 | Rigid-Flex PCB:Peel-off strength | 1.4N |
| 29 | Rigid-Flex PCB:Planeness | Less than 15um before baking; less than 30um after baking |
| 30 | Rigid-Flex PCB:thermal shock | 288℃(3 times within 10 seconds) |
| 31 | Rigid-Flex PCB:W/B gold wire pull | > 6g |
| 32 | Rigid-Flex PCB:Min board thickness | FPCB:0.1mm、4Layers:0.3mm 、6Layers:0.5mm、8Layers:0.6mm、10Layers:0.8mm |