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High -frequency pcb

Frequency PCB Process capability
No. Item  Capability
1 Rogers Material RO3000 Series, RO4000 Series, RO5000 Series, RO6000 Series,
5 Rogers PP (Semi-cured adhesive) RO4403(4mil), RO4450B(4mil), RO4450F(4mil), RO3001(1.5mil), RO2929
6 Arlon Material Diclad, Cuclad, Isoclad, AD Series, CLTE eles
7 Arlon PP (Semi-cured adhesive) 25FR 1080(4mil), 25FR 2112(6mil), Cuclad6700(1.5mil)
8 Taconic Material TLX, TLY, RF, TLC, TLG Series, CER10 eles
9 Taconic PP (Semi-cured adhesive) TP-32(4mil), TPG(4mil), HT1.5(1.5mil)
10 Wanglin Material F4BK, F4BM, F4B, TP-1/2, TF-1/2, CT330, CT350, CT440, CT615
11 Finished copper thickness 0.5oz-10 oz
14 The number of layers 1-20layers
15 The Number of layers of high-frequency mixed PCB 4-20layers
17 Min core thickness 4mil
18 Max finished board size  800*600mm
199 Max PTFE array size(thicknesss 0.50mm) 16*18mm
20 Finished board thickness 0.13-8.0mm(Double Side)      0.4-8.0mm(Multi-Layers)
Min PTFE material hole size 0.3mm
21 Dielectric constant 1-25
22 Material thickness tolerance ±0.05mm
23 Finish board thickness tolerance Board thickness≤1.0mm:±0.1, Board thickness>1.0mm:±10%
24 Min Pattern Width tolerance ±20um
25 Min Pattern Width/Spacing 0.075mm