Hdi pcb
Hdi pcb
| HDI PCB Process capability | ||
| No. | Item | Capability |
| 1 | Material | Brand：SY、ITEQ、KB、NP |
| 2 | Construction | N+N、N+X+N、1+(N+X+N)+1 |
| 3 | Layer | 4-40Layers |
| 4 | Min Pattern Width / Spacing | 2/2mil |
| 5 | Min Mechanical Hole | 0.15mm |
| 6 | Min Thickness of Core Board | 2mil |
| 7 | Laser Hole | 0.05-0.1mm |
| 8 | Min thickness of PP | 2mil |
| 9 | Max diameter of resin plug hole | 0.5mm |
| 10 | Electroplating to fill holes | 0.15mm |
| 11 | The distance from the wall of via to the pattern | 6mil |
| 12 | Laser drilling hole accuracy | ±0.025mm |
| 13 | Min BGA pad center distance | 0.3mm |
| 14 | Back drilled/countersink hole tolerance | ±0.05mm |
| 15 | Through-hole plating penetration capacity | 16:1(Thickness to aperture ratio) |
| 16 | Blind hole plating penetration capacity | 1.5:1(Thickness to aperture ratio) |
| 17 | BGA min PAD | 0.15mm |
| 18 | Min Buried Hole(Mechanical Hole) | 0.15mm |
| 19 | Min Buried Hole(Laser Hole) | 0.05mm |
| 20 | Min Blind Hole(Laser Hole) | 0.05mm |
| 21 | Min Blind Hole(Mechanical Hole) | 0.15mm |
| 22 | Minimum spacing between laser blind hole and mechanical buried hole | 0.2mm |
| 23 | Interlaminar alignment | ±0.05mm |